High-performance Thermal Management & Interface Material Solution

We provide Thermal Interface Material with through-plane up to 25W/mK and in-plane up to 1,000W/mK that improves cooling capacity by reducing heat loss.

With demands of higher processing speed & power in many electronic devices, more heat will be generated. Removing heat effectively & efficiently is important to maintain the performance of the electronics devices.

Three main categories of TIM:
Thermal Conductive Film
Thermal Conductive Paste
Thermal Conductive Adhesive

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High-performance Thermal Management & Interface Material Solution

Graphite TIM

Standard Thermal Pad

High Performance Thermal Pad

Metal-Based TIM

Phase-Change TIM

Thermal Gel

Thermal Grease

Low Viscosity Metal

Hybrid TIM

Heat Insulation Material

We provide Thermal Interface Material with through-plane up to 25W/mK and in-plane up to 1,000W/mK that improves cooling capacity by reducing heat loss.

Inspiraz Technology Pte Ltd